| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 76015-5403 |
| Color: | Black |
| Series: | 76015 - GbX I-Trac |
| Amperage: | 1 A |
| Connector Type: | GbX I-Trac |
| Number of Contacts: | 56 |
| Number of Rows: | 7 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 85 °C |
| Pitch: | 1.85 mm, 3.7 mm |
| Voltage: | 120 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 4-pair, Open Pin Field |
| Data Rate: | 12 Gb/s |
| Tail Length: | 2.1 mm |
| Packaging: | Tray |
| Operating Temperature Range: | 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 56 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .762 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Number of Columns: | 4 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1 mm, 2.7 mm |
| Guide to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane, Midplane, Orthogonal |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0760155403 |
| SKU: | MOL76015-5403 |
76015-5403
| Heilind Number: | MOL76015-5403 |
| Manufacturer: | Molex |
| Manufacturer Number: | 76015-5403 |
| Datasheet: | Product Specification |
| ECAD Model: | |
Description:
GbX I-Trac Vertical Header Module, 1.85mm by 3.70mm Pitch, Right Guide, Left Open, 7 Rows, 4 Columns, 56 Circuits, Mating Pin Length 4.70mm, Lead-Free
More >>Specifications
Detailed Description
Enhance your PCB connectivity with our GbX I-Trac Vertical Header Module. Featuring a 1.85mm by 3.70mm pitch, this module offers precise alignment with a Right Guide and Left Open configuration. With 56 gold-plated circuits and a 4.70mm mating pin length, it ensures reliable signal transmission at up to 12 Gb/s. Designed for durability, it is made of High Temperature Thermoplastic and High Performance Alloy (HPA) contacts. RoHS compliant and lead-free, it meets stringent environmental standards. Ideal for backplane and orthogonal board-to-board configurations, this black header module is a versatile solution for your connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/08/2025 | 516698 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is relocating the assembly machines as part of its business strategy plant as a result of the change there is no COO change as both Locations are located in Malaysia. | Download | |||
Availability
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Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 76015-5403 |
| Other Names: | 0760155403 |