76055-1716

Heilind Number:MOL76055-1716
Manufacturer:Molex
Manufacturer Number:76055-1716
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Impact 100 Ohm 5 Pair Vertical Backplane Header, Unguided, Left Endwall, 14 Columns, 210 Circuits, Pin Length 4.50mm, Plated Through Hole Dimension 0.39mm, Lead Free

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 76055-1716
Color:Black
Series:76055 - Impact
Amperage:.75 A
Connector Type:Impact
Number of Contacts:210
Number of Rows:15
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:1.9 mm
Voltage:30 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Impedance:100 Ω
Keying:No
Component Type:PCB Header
Number of Pairs:5
Data Rate:25 Gb/s
Tail Length:1.4 mm
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:210
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:No
PCB Thickness (Recommended):1 mm
Number of Columns:14
Contact Termination Plating:Tin
Termination Pitch:1.9 mm
Guide to Mating Part:No
Stackable:No
Board to Board Configuration:Conventional
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0760551716
SKU:MOL76055-1716

Detailed Description

Enhance connectivity in your system with our Impact 100 Ohm 5 Pair Vertical Backplane Header. Featuring an unguided design, left endwall placement, and 14 columns, this component offers seamless integration for your PCB setup. With 210 circuits and a pin length of 4.50mm, it ensures reliable performance in high-speed applications. The plated through hole construction with a dimension of 0.39mm guarantees secure attachment, while the lead-free composition aligns with environmental standards. Crafted from high-temperature thermoplastic and High Performance Alloy (HPA) contacts, it ensures durability and efficiency. Operating at 30V AC/DC and 0.75A, with a pitch of 1.9mm, this connector is suitable for various power and signal requirements. Gold plating in the contact mating area, along with a mating cycle of 200, ensures long-term functionality. Perfect for backplane setups, it offers a comprehensive solution for your connectivity needs.