76155-3803

MOL76155-3803
Heilind Number:MOL76155-3803
Manufacturer:Molex
Manufacturer Number:76155-3803
Datasheet:Packaging Specifications
ECAD Model:
3D Model

Description:

Impact 100 Ohm 4 Pair Vertical Backplane Header, Left Guided, Open Endwall, 8 Columns, 96 Circuits, Pin Length 4.50mm, Plated Through Hole Dimension 0.46mm, Lead-Free

More >>

Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:Molex
Manufacturer Part Number:Molex 76155-3803
Color:Black
Series:76155 - Impact
Amperage:.75 A
Connector Type:Impact
Number of Contacts:96
Number of Rows:12
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:1.9 mm
Voltage:30 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Impedance:100 Ω
Keying:No
Component Type:PCB Header
Number of Pairs:4
Data Rate:25 Gb/s
Tail Length:1.4 mm
Packaging:Tray
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:96
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Yes
Polarized to PCB:Yes
PCB Thickness (Recommended):1 mm
Number of Columns:8
UL Agency Certification:E29179
Contact Termination Plating:Tin
Termination Pitch:1.9 mm
Guide to Mating Part:Yes
Stackable:No
Board to Board Configuration:Conventional
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0761553803
SKU:MOL76155-3803

Detailed Description

Enhance connectivity in your electronic systems with this Impact 100 Ohm 4 Pair Vertical Backplane Header. Designed for efficiency, it features a left guided, open endwall configuration with 8 columns and 96 circuits, ensuring seamless integration into your PCB setup. The high-performance alloy contact material and gold plating guarantee reliable signal transmission, while the lead-free, high-temperature thermoplastic construction offers durability in various operating environments. With a pitch of 1.9mm and an impedance of 100Ω, this header is suitable for high-speed data applications, supporting data rates up to 25 Gb/s. Trust in its quality and compliance with industry standards for a dependable board-to-board connection solution in your projects.