| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 76165-1125 |
| Color: | Black |
| Series: | 76165 - Impact |
| Amperage: | .75 A |
| Connector Type: | Impact |
| Number of Contacts: | 90 |
| Number of Rows: | 9 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 1.9 mm |
| Voltage: | 30 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 100 Ω |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 3-pair |
| Data Rate: | 25 Gb/s |
| Tail Length: | 1.4 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 90 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 10 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | No |
| Stackable: | No |
| Board to Board Configuration: | Conventional, Mezzanine |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0761651125 |
| SKU: | MOL76165-1125 |
76165-1125
Specifications
Detailed Description
Enhance your backplane connectivity with our Impact 100 Ohm 3 Pair Vertical Backplane Header. Featuring a dual endwall design and 10 columns, this header offers reliable performance for high-speed data transmission. With 90 gold-plated contacts and a contact material of High Performance Alloy (HPA), it ensures excellent conductivity and durability. The through-hole termination method with compliant pins and a lead-free finish guarantees easy installation and environmental compliance. Designed for a maximum operating temperature of 85°C and a data rate of 25 Gb/s, it's suitable for demanding industrial applications. Its high-temperature thermoplastic construction and UL agency certification provide added assurance of quality and safety. Whether for mezzanine or conventional board-to-board configurations, this backplane header is the ideal choice for your connectivity needs. Compliant with RoHS standards, it's a sustainable and reliable solution for your electronic systems. Elevate your backplane connections with this advanced PCB header.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
Availability
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Stock Location:
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Unit Of Measure:
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Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 76165-1125 |
| Other Names: | 0761651125 |