| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 76165-5337 |
| Color: | Black |
| Series: | 76165 - Impact |
| Amperage: | .75 A |
| Connector Type: | Impact |
| Number of Contacts: | 54 |
| Number of Rows: | 9 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.9 mm |
| Voltage: | 30 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 100 Ω |
| Keying: | Yes |
| Component Type: | PCB Header |
| Number of Pairs: | 3 |
| Data Rate: | 25 Gb/s |
| Tail Length: | 1.4 mm |
| Packaging: | Tray |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 54 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 6 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | Yes |
| Stackable: | No |
| Board to Board Configuration: | Conventional |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0761655337 |
| SKU: | MOL76165-5337 |
76165-5337
| Heilind Number: | MOL76165-5337 |
| Manufacturer: | Molex |
| Manufacturer Number: | 76165-5337 |
| Datasheet: | RoHS Certificate of Compliance |
| ECAD Model: |
Description:
Impact 100 Ohm 3 Pair Vertical Backplane Header, Right Guided, Open Endwall, 6 Columns, 54 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.39mm, Key Position C, Lead Free
More >>Specifications
Detailed Description
Enhance connectivity with our Impact 100 Ohm 3 Pair Vertical Backplane Header. Designed for optimal performance, this header features a right guided orientation with an open endwall, accommodating 54 circuits with a pin length of 4.90mm. Made of high temperature thermoplastic and plated through holes, it ensures durability and reliability in various applications. With a pitch of 1.9mm and high-performance alloy (HPA) contacts, it guarantees efficient signal transmission at a data rate of 25 Gb/s. Gold plated contact mating areas offer enhanced conductivity, while its compliant pin termination method facilitates easy installation onto PCBs. Meeting stringent quality standards, this header is essential for board-to-board configurations in high-speed electronic systems.

