| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 76455-1618 |
| Color: | Black |
| Series: | 76455 - Impact |
| Amperage: | .75 A |
| Connector Type: | Impact |
| Number of Contacts: | 96 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 1.9 mm |
| Voltage: | 30 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 100 Ω |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 2-pair |
| Data Rate: | 25 Gb/s |
| Tail Length: | 1.4 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 96 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 16 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | No |
| Stackable: | No |
| Surface Mount Compatible: | No |
| Board to Board Configuration: | Conventional |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0764551618 |
| SKU: | MOL76455-1618 |
76455-1618
| Heilind Number: | MOL76455-1618 |
| Manufacturer: | Molex |
| Manufacturer Number: | 76455-1618 |
| Datasheet: | RoHS Certificate of Compliance |
| ECAD Model: |
Description:
Impact 100 Ohm 2 Pair Vertical Backplane Header, Unguided, Left Endwall, 16 Columns, 96 Circuits, Pin Length 5.50mm, Plated Through Hole Dimension 0.39mm, Lead-Free
More >>Specifications
Detailed Description
Enhance your backplane connections with our Impact 100 Ohm 2 Pair Vertical Header. Designed for optimal performance, this unguded header features a left endwall orientation, 16 columns, and 96 circuits. With a contact material of High Performance Alloy (HPA) and gold plating, it ensures reliable conductivity. The lead-free construction and high temperature thermoplastic material make it suitable for a wide range of applications. With a pitch of 1.9mm and a data rate of 25Gb/s, it's perfect for high-speed connectivity. Operating efficiently in temperatures ranging from -55 to 85°C, this PCB header is RoHS compliant, making it a sustainable choice for your projects. Trust in its durability, with a mating cycle of 200, and its tray packaging for convenient handling. Elevate your backplane connections with this essential component.

