76560-1118

MOL76560-1118
Heilind Number:MOL76560-1118
Manufacturer:Molex
Manufacturer Number:76560-1118
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Impact 100 Ohm 6 Pair RAM Right-Angle Header, Unguided, Left Endwall, 10 Columns, 180 Circuits, Pin Length 5.50mm, Plated Through Hole Dimension 0.39mm, Lead Free

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:Molex
Manufacturer Part Number:Molex 76560-1118
Color:Black
Series:76560 - Impact
Amperage:.75 A
Connector Type:Impact
Number of Contacts:180
Number of Rows:18
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:1.9 mm
Voltage:30 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Right Angle
Impedance:100 Ω
Keying:No
Component Type:PCB Header
Number of Pairs:6
Data Rate:25 Gb/s
Tail Length:1.4 mm
Packaging:Tray
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:180
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:No
PCB Thickness (Recommended):1 mm
Number of Columns:10
UL Agency Certification:E29179
Contact Termination Plating:Tin
Termination Pitch:1.9 mm
Guide to Mating Part:No
Stackable:No
Board to Board Configuration:Coplanar
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0765601118
SKU:MOL76560-1118

Detailed Description

Enhance your PCB connectivity with our Impact 100 Ohm 6 Pair RAM Right-Angle Header. Featuring an unguided design with a left endwall orientation, this header offers 180 circuits and 10 columns for versatile connectivity options. Crafted with high-performance alloy contacts and gold plating, it ensures reliable signal transmission at a maximum amperage of 0.75 A and voltage of 30 V AC/DC. With a pitch of 1.9 mm and impedance of 100 Ω, it supports high-speed data rates up to 25 Gb/s. The through-hole termination method and lead-free construction make it environmentally friendly, while its high-temperature thermoplastic housing guarantees durability in various operating conditions. Perfect for backplane and board-to-board configurations, this header is essential for demanding electronic applications.