76691-1200

Heilind Number:MOL76691-1200
Manufacturer:Molex
Manufacturer Number:76691-1200
Datasheet:Application Specification
ECAD Model:
3D Model

Description:

EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 1.57mm PCB Thickness, 200 Circuits

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 76691-1200
Color:Black
Series:76691 - EdgeLine
Amperage:1.52 A
Connector Type:EdgeLine
Number of Contacts:200
Termination Method:Through Hole - Compliant Pin
Contact Material:Copper Alloy
Pitch:8 mm
Voltage:250 VAC
Material:High Temperature Thermoplastic
Orientation:Vertical
Component Type:Edgecard to PCB
Data Rate:12.5 - 20 Gb/s
Packaging:Tray
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:200
Mating Cycles:200
PCB Locator:No
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.79 mm
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Termination Pitch:.8 mm
Power and Signal Configuration:200 s - 0 p
Edge Card Thickness:1.57 mm
High Power Bay:No
Circuit Range:65 - 200 Circuits
Standards Met:General
Material Flammability Standard:94V-0
Part Aliases:0766911200
SKU:MOL76691-1200

Detailed Description

Enhance your PCB connectivity with our EdgeLine Vertical Connector, featuring a high-speed data rate of 12.5 Gbps. Designed for seamless integration, this connector boasts a 0.80mm pitch and accommodates 200 circuits, ensuring reliable power and signal transmission. With gold plating in the contact mating area and a durable construction of high-temperature thermoplastic, it guarantees optimal performance in demanding environments. Its through-hole termination method with compliant pins simplifies installation on PCBs with a thickness of 1.57mm, while its black color and sleek design add a touch of sophistication to your electronic setups. RoHS compliant and meeting stringent industry standards, this connector is a must-have for any professional application requiring efficient board-to-board connectivity.