76855-9608

Heilind Number:MOL76855-9608
Manufacturer:Molex
Manufacturer Number:76855-9608
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Impact 100 Ohm 3 Pair Vertical Orthogonal Header Right Guide, Left Endwall, 6 Columns, 54 Circuits, Pin Length 5.50mm, Plated Through Hole Dimension 0.39mm, Lead-Free

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 76855-9608
Color:Black
Series:76855 - Impact
Amperage:.75 A
Connector Type:Impact
Number of Contacts:54
Number of Rows:9
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:1.9 mm, 2.15 mm
Voltage:30 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Impedance:100 Ω
Keying:No
Component Type:PCB Header
Number of Pairs:3-pair
Data Rate:25 Gb/s
Tail Length:1.4 mm
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:54
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Yes
Polarized to PCB:Yes
PCB Thickness (Recommended):3 mm
Number of Columns:6
Contact Termination Plating:Tin
Termination Pitch:1.9 mm, 2.15 mm
Guide to Mating Part:Yes
Stackable:No
Board to Board Configuration:Orthogonal Midplane
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0768559608
SKU:MOL76855-9608

Detailed Description

Elevate your connectivity with this Impact 100 Ohm 3 Pair Vertical Orthogonal Header. Designed for optimal performance, this header features a right guide, left endwall, and six columns, accommodating 54 circuits with a pin length of 5.50mm. Crafted with high-performance alloy (HPA) contacts and plated through-hole technology, it ensures reliable signal transmission. With a pitch of 1.9mm and 2.15mm, this header supports high-speed data rates up to 25 Gb/s. Its durable construction, compliant with RoHS standards, guarantees longevity and environmental responsibility. Perfect for PCB applications, this header is ideal for board-to-board configurations, offering enhanced connectivity in a compact and efficient design. Elevate your network infrastructure with this essential component.