78035-0301

Heilind Number:MOL78035-0301
Manufacturer:Molex
Manufacturer Number:78035-0301
Datasheet:Drawing
ECAD Model:
3D Model

Description:

0.60mm Pitch miniDIMM DDR3 Socket, Surface Mount, 22.5

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 78035-0301
Series:78035 - MiniDIMM
Amperage:1 A
Connector Type:MiniDIMM
Housing Material:High Temperature Thermoplastic
Mount Type:Surface Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Contact Plating:Gold
Maximum Operating Temperature:85 °C
Pitch:6 mm
Voltage:30 V
Material:High Temperature Thermoplastic
Socket Type:DIMM
Keying:Yes
Component Type:Socket
Housing Color:Black
Packaging:Tray
Operating Temperature Range:-55 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:244
Mating Cycles:25
PCB Locator:Yes
PCB Retention:Yes
Contact Termination Plating Thickness:2.540 µm
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):005
Max. Cycles at Max. Process Temperature:001
Electrical Model:Yes
Voltage Key:1.5 V
Material Flammability Standard:94V-0
Part Aliases:0780350301
SKU:MOL78035-0301

Detailed Description

Enhance memory module connectivity with our cutting-edge MiniDIMM Socket, part of the 78035 series. Engineered for optimal performance, this surface-mount socket boasts a high temperature thermoplastic housing and copper alloy contacts with gold plating, ensuring reliable power delivery up to 30V and 1A. With a compact .6mm pitch and 244 loaded contacts, it offers seamless integration on PCBs, complete with keying for easy alignment. Certified for UL and CSA standards, it guarantees quality and safety, while RoHS compliance underscores our commitment to environmental responsibility. Ideal for DIMM applications, this black socket, packaged in a convenient tray, is a must-have for efficient memory solutions.