| Attribute | Value |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 78727-0001 |
| SKU: | MOL78727-0001.P |
78727-0001
Specifications
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Download | |||
| 02/27/2022 | 511276 - Change Supplier. add alternative copper materials "YCuT-FX-EH", JPN DOWA HOLDINGS. Current "NKT322 ESH" JPN Nippon alternative: "YCuT-FX-EH", JPN DOWA HOLDINGS. | Download | |||
| 09/26/2020 | 508585 - Change to Product. Improvement to metal shell surface plating changing from matte tin to nickel. no impact to form fit or function | Download | |||
| 11/18/2017 | 502609 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download | |||
| 05/22/2014 | GCM 10634281 - Outsourcing Component Or Subcomponent. Because the order of Micro SIM card connector 78727 series are increase,the machine of insert mold is shortage and can't cover current capacity.The purpose of the change is cover current capacity.So we will copy mold and transfer mold to outsourcing supplier for component on insert mold HSG.The Change is no impact for FG. | Download | |||

