87761-5000

Heilind Number:MOL87761-5000
Manufacturer:Molex
Manufacturer Number:87761-5000
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Milli-Grid Header, Dual Row, Dual Body, Through Hole, Vertical, 50 Circuits, 2.50µm Tin (Sn) Plating, 10.00mm Stacking Height, Tray, Lead-Free

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 87761-5000
Color:Black
Series:87761 - Dual Body - Milli-Grid
Amperage:2 A
Connector Type:Dual Body, Milli-Grid
Number of Contacts:50
Number of Rows:2
Termination Method:Through Hole
Contact Material:Copper Alloy
Body Orientation:Straight
Pitch:2 mm
Voltage:125 V
Material:Nylon
Orientation:Vertical
Keying:No
Operating Temperature Range:-55 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:50
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:1.27 µm
Polarized to Mate:No
Connector System:Board to Board
Contact Termination Plating:Nickel
Maximum Solder Process Temperature:250 °C
Lead Free Process Capability:WAVE
Duration at Max. Process Temperature (seconds):010
Max. Cycles at Max. Process Temperature:003
Termination Pitch:2 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:No
Mated Height:3.5 mm
Stackable:No
Breakaway:Yes
Make First / Break Last:No
Shroud Type:No
Material Flammability Standard:94V-0
Part Aliases:0877615000
SKU:MOL87761-5000