| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 87797-2002 |
| Color: | Black |
| Series: | 87797 - C-Grid - Dual Body |
| Amperage: | 3 A |
| Connector Type: | C-Grid, Dual Body |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Copper Alloy |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 3 mm |
| Packaging: | Tray |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 20 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 2.032 µm |
| Polarized to Mate: | No |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Board to Board |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 2.54 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | No |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | Yes |
| Make First / Break Last: | No |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0877972002 |
| SKU: | MOL87797-2002 |
87797-2002
| Heilind Number: | MOL87797-2002 |
| Manufacturer: | Molex |
| Manufacturer Number: | 87797-2002 |
| Datasheet: | Test Summary |
| ECAD Model: |
Description:
C-Grid Header, Through Hole, Dual Row Dual Body, Vertical, 0.76µm Gold (Au) Plating, 26.60mm Stacking Height, Tray Packaging, 20 Circuits, Lead-Free
More >>Specifications
Detailed Description
Enhance your PCB connectivity with this C-Grid Header, featuring a through-hole design for secure attachment. Its dual-row, dual-body construction ensures reliable performance, while the 0.76µm gold plating guarantees optimal signal transfer. With a 26.60mm stacking height and 2.54mm pitch, it offers versatility in various applications. This header, with tray packaging for convenience, accommodates 20 circuits and is lead-free, meeting environmental standards. Crafted from high-temperature thermoplastic, it ensures durability even in demanding conditions. The vertical orientation and black color add to its functionality and aesthetics, making it a valuable component in your electronic assemblies.

