87834-1619

Heilind Number:MOL87834-1619
Manufacturer:Molex
Manufacturer Number:87834-1619
Datasheet:Drawing
ECAD Model:
3D Model

Description:

2.54mm Pitch C-Grid Header, Dual Row, Low Profile, Vertical, Shrouded, 16 Circuits, 0.13

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 87834-1619
Color:Black
Series:87834 - C-Grid
Amperage:2.5 A
Connector Type:C-Grid
Number of Contacts:16
Number of Rows:2
Termination Method:Through Hole
Body Orientation:Straight
Pitch:2.54 mm
Voltage:250 VDC
Material:Polyester
Orientation:Vertical
Keying:No
Tail Length:3.43 mm
Packaging:Tray
Operating Temperature Range:-55 - 120 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.127 µm
Number of Contacts Loaded:16
PCB Locator:No
PCB Retention:Without
Polarized to PCB:Yes
Contact Termination Plating Thickness:1.905 µm
Polarized to Mate:Yes
Connector System:Wire to Board
UL Agency Certification:E29179
Contact Termination Plating:Tin
Maximum Solder Process Temperature:235 °C
Lead Free Process Capability:WAVE
Duration at Max. Process Temperature (seconds):003
Max. Cycles at Max. Process Temperature:001
Termination Pitch:2.54 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:No
Stackable:No
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Material Flammability Standard:94V-0
Part Aliases:0878341619
SKU:MOL87834-1619

Detailed Description

Enhance your PCB connectivity with our C-Grid 87834 series. Designed for reliable performance, this straight, through-hole connector features 16 gold-plated contacts in a 2-row configuration, ensuring secure mating with a pitch of 2.54mm. With a 2.5A current rating and 250VDC voltage capacity, it meets stringent operational requirements. Constructed from durable polyester and compliant with RoHS standards, this connector offers high-temperature tolerance (-55 to 120°C) and lead-free soldering capability. Its vertical orientation and polarized design facilitate easy and error-free installation, making it ideal for a wide range of applications in electronics and telecommunications.