| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 87898-1224 |
| Color: | Black |
| Series: | 87898 - C-Grid - SL |
| Amperage: | 3 A |
| Connector Type: | C-Grid, SL |
| Number of Contacts: | 12 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | Nylon |
| Orientation: | Vertical |
| Keying: | No |
| Contact Mating Area Plating: | Gold |
| Number of Contacts Loaded: | 12 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Polarized to Mate: | No |
| Connector System: | Board to Board, Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | 2.54 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | No |
| Stackable: | No |
| Breakaway: | Yes |
| Make First / Break Last: | No |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0878981224 |
| SKU: | MOL87898-1224 |
87898-1224
Specifications
Detailed Description
Discover the sleek and efficient C-Grid / SL Header for your surface mount applications. Featuring a breakaway design and vertical orientation, this connector boasts 12 circuits with 0.38µm Gold (Au) Plating for optimal conductivity. Packaged in a convenient tube, it comes without a cap and is lead-free, making it environmentally friendly. With a 3A amperage and 250V voltage rating, it ensures reliable performance. Crafted from durable Nylon with copper alloy contacts, it guarantees long-lasting use. Suitable for board to board or wire to board connections, this connector is RoHS compliant, meeting stringent environmental standards. Perfect for PCB applications, it offers easy surface mount termination, making it a versatile and essential component for your electronic projects.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 05/01/2014 | GCM 10635826 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that a change of manufacturing location from Singapore to Johor, Malaysia by the housing molding sub-con will be implemented on the housing of 2.54MM PITCH SINGLE ROW WAFER WITH STAND OFF OPTION, 0.64 SQ PIN, 87891 series connector. This letter takes the place of notice to customer the reason of change is due to housing molding sub-con is ceasing production in Singapore and shifting to Johore, Malaysia which is also a Molex qualifed manufacturing site. We verify impact of the change is confirmed as no impact to the quality of products shipped. | Download | |||
| 04/06/2014 | GCM 10629275 - New, Modified, Or Replacement Tooling. | Download | |||

