90131-0128

Heilind Number:MOL90131-0128
Manufacturer:Molex
Manufacturer Number:90131-0128
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

2.54mm Pitch C-Grid III Header, Dual Row, Vertical, 16 Circuits, Tin (Sn) Plating

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 90131-0128
Color:Black
Series:90131 - C-Grid III
Amperage:3 A
Connector Type:C-Grid III
Number of Contacts:16
Number of Rows:2
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Straight
Pitch:2.54 mm
Voltage:350 V
Material:Polyester
Orientation:Vertical
Keying:No
Tail Length:2.9 mm
Packaging:Tray
Operating Temperature Range:-55 - 125 °C
Contact Mating Area Plating:Tin
Number of Contacts Loaded:16
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Polarized to Mate:No
Connector System:Wire to Board
CSA Agency Certification:LR19980
Contact Termination Plating:Tin
Lead Free Process Capability:WAVE
Termination Pitch:2.54 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:No
Stackable:Yes
Breakaway:Yes
Make First / Break Last:No
Shroud Type:No
Part Aliases:0901310128
SKU:MOL90131-0128

Detailed Description

Enhance your electronic connections with our C-Grid III 90131 series black PCB Pin Header. Featuring 16 gold-plated brass contacts in a straight, two-row configuration with a 2.54mm pitch, this connector ensures reliable power and signal transmission. Suitable for through-hole mounting, it offers a secure and durable connection in various applications. With a voltage rating of 350V and an amperage of 3A, it meets high-performance standards. The polyester body, operating at temperatures ranging from -55 to 125°C, guarantees robustness in harsh environments. Designed for wire-to-board connections, this connector is stackable and breakaway, providing versatility in PCB assembly. RoHS compliant and lead-free process capable, it aligns with environmental regulations. Elevate your PCB design with this essential component for seamless and efficient connectivity.