TE RBK-X1 Processor for Raychem Heat Shrink Products
TE Connectivity's (TE) latest advancement in heat shrink processing, the RBK-X1, is specifically designed for consistent, repeatable wire sealing for a wide range of Raychem heat shrink products. The RBK-X1 processor is a semi-automatic unit designed specifically for sealing wire bundles, splice, and ring terminals. It includes long-life heating elements, operator key lock/password protection levels, individual selections for installation times, temperature and product size information. This competitively priced alternative to less measurably reliable heat guns offers a small footprint, simple touch screen interface, and the ability to interface with an upstream ultrasonic welder.
- Fast, affordable alternative to heat guns
- Semi-automatic unit designed to seal products for wire bundles, splice terminals and ring terminals
- Includes long-life heating elements with operator key lock/password protection levels
- Offers reliable PLC (Programmable Logic Controller) control with short machine depth to accommodate a larger front working area
- Short profile with fast, consistent processing speeds (as low as 6 seconds)
- Flexible design with multiple operation modes namely, stand-alone, sequenced and communication with upstream ultrasonic welder
- Industrial (non-Robotics)
- Appliance & HVAC
- Automotive (non-EV)
- Distributors
- Wire bundles
- Splice terminals
- Ring terminals
- AD&M
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| Heat Shrink Equipment, Discrete, In-Line Splice/Stub Splice/Ring Terminal, 220 V, Maximum Substrate Length 65 mm | |||
