Molex Spring Clips

Molex introduces "New" low profile, high durability spring clips that offer smartphone makers maximum cost savings with greater design flexibility and specific loading control.

Benefits include a reinforced anti-snag design that prevents contact damage during assembly processing and yield loss, kinked ribs with a closed tip to prevent solder wicking,1,500 durability cycles deliver sustained high performance, and Device-to-PCB grounding contact which reduces EMI noise and electrostatic discharge.

The dimple is designed with a reduced area which provides higher contact pressure between mated device and spring clip for enhanced contact reliability, also features a pick-and-place area for nozzle pre-load function.

This new Series from Molex is RoHS Compliant, Halogen free and Glow Wire Compliant.

  • Wide working range from 0.25 to 1.10mm that offers greater design flexibility with specific loading control
  • Anti-snag design, which provides contact damage during assembly processing and yield loss
  • Narrow clip width of 1.00mm that supports small PCB applications
  • 1,500 durability cycles which deliver sustained high performance
  • Kinked ribs that prevent solder wicking
  • Device-to-PCD grounding contact, which reduces EMI noise and electrostatic discharge
  • RF-to-PCB contact that provides greater cost savings when used with non-soldered wire-less devices
  • Industrial (non-Robotics)
  • Computer / Datacom / Telecommunications
  • Banking / Office / Retail Systems
  • Consumer Electronics
  • Other

Wireless LAN, Smartphones, SOHO Switches and Routers, Surveillance Cameras, Digital Cameras, Digital Video Cameras, POS Terminals, Set Top Box, Home Office

Molex Spring Clips Video