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Aries Introduces Unique Solderable Center Probe Socket For Universal Device Package Debugging

Frenchtown, NJ, December 2004 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has announced the development of a unique, solderable center probe socket which enables users to debug a wide range of package types - BGA, UBGA, MLF, QFN and others - on the same package footprint. This new surface mount adapter securely connects to standard Aries center probe test sockets, providing a quick and highly reliable package test on populated PC boards.

The new debugging socket provides .060" (1.52mm) clearance for 0.80mm and higher package pitch. The socket pressure mounts to the adapter, which is soldered to the pre-existing PCB footprint via standard reflow process.

The new Aries debug socket features an insertion loss of only 1 dB up to 5 GHz. Socket cycle life is over 100,000 insertions and withdrawals. Useable for virtually all packages up to 13mm square, the new socket is particularly ideal for SRAM and DRAM packages.

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