ABC55DKUI-S1243

Heilind Number:SULABC55DKUI-S1243
Manufacturer:Sullins Connector Solutions
Manufacturer Number:ABC55DKUI-S1243
ECAD Model:
3D Model

Description:

PPS & BERYLLIUM COPPER; .0

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions ABC55DKUI-S1243
Amperage:3 A
Gender:Female
Number of Contacts:110
Number of Rows:2
Mount Type:Threaded
Termination Method:Solder
Contact Material:Beryllium Copper
Contact Plating:Gold
Pitch:0.1 in
Voltage:700 VAC
Contact Type:Cantilever
Orientation:Right Angle
Number of Positions:110
Tail Length:.25 in, 6.35 mm
Operating Temperature Range:-65 - 150 °C
Connector Height:13.97 mm, .55 in
Connector Width:10.16 mm, .4 in
Current Rating:3 A
Termination Plating:Matte Tin
Voltage Rating:700 VAC
Card Thickness:0.062 in
SKU:SULABC55DKUI-S1243

Detailed Description

Introducing the ABC55DKUI-S1243, a high-performance board to board PCB connector designed for seamless connectivity in demanding environments. Crafted with precision using PPS and Beryllium Copper materials, this connector ensures optimal conductivity and durability. The female connector features two rows with a threaded mount type for secure attachment. With a contact rating of 3A and voltage tolerance of 700 VAC, it guarantees reliable power transmission. Each contact is plated with gold for enhanced conductivity, while the termination method is through-hole for easy installation. The cantilever contact type and right-angle orientation offer versatility in application. With 110 positions and a pitch of 2.54mm, it caters to complex connectivity needs. Operating flawlessly in temperatures ranging from -65 to 150°C, this connector is suitable for a wide range of industries. Its compact design, with a height of 13.97mm and width of 10.16mm, allows for efficient PCB integration. The termination plating with matte tin ensures longevity. Ideal for aerospace, defense, and industrial applications, the ABC55DKUI-S1243 is a reliable solution for high-reliability connectivity requirements.