ACM10DRMN-S664

Heilind Number:SULACM10DRMN-S664
Manufacturer:Sullins Connector Solutions
Manufacturer Number:ACM10DRMN-S664
ECAD Model:
3D Model

Description:

PPS & BERYLLIUM COPPER; .0

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions ACM10DRMN-S664
Amperage:3 A
Gender:Female
Number of Contacts:20
Number of Rows:2
Mount Type:No Mounting
Termination Method:Wire Wrap
Contact Material:Beryllium Copper
Contact Plating:Gold
Pitch:0.156 in
Voltage:950 VAC
Contact Type:Loop Bellow
Orientation:Straight
Number of Positions:20
Tail Length:14.22 mm, .56 in
Operating Temperature Range:-65 - 150 °C
Connector Height:15.49 mm, .61 in
Connector Width:11.94 mm, .47 in
Current Rating:3 A
Termination Plating:Matte Tin
Voltage Rating:950 VAC
Card Thickness:0.125 in
SKU:SULACM10DRMN-S664

Detailed Description

The ACM10DRMN-S664 is a high-performance board-to-board PCB connector designed for demanding applications. Featuring PPS and Beryllium Copper construction, this connector ensures robust and reliable connectivity. With a contact plating of gold, it offers excellent conductivity and corrosion resistance. The contact material, Beryllium Copper, further enhances durability. This female connector has two rows with 20 positions each, making it suitable for complex circuitry. Its wire wrap termination method and loop bellow contact type provide secure connections. Operating at a voltage of 950 VAC and with an amperage rating of 3A, it meets high-power requirements. With a wide operating temperature range from -65 to 150 °C, it's ideal for harsh environments. The connector's straight orientation and no-mounting design offer versatility in installation. Its compact size, with a height of .61in and width of .47in, makes it space-efficient. The matte tin termination plating ensures compatibility with various PCB materials. Overall, the ACM10DRMN-S664 is a top choice for reliable and durable board-to-board connections in industrial and hi-rel applications.