ACM25DTAD

Heilind Number:SULACM25DTAD
Manufacturer:Sullins Connector Solutions
Manufacturer Number:ACM25DTAD
ECAD Model:
3D Model

Description:

PPS & BERYLLIUM COPPER; .0

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions ACM25DTAD
Pitch:0.156 in
Gender:Female
Voltage:950 VAC
Amperage:3 A
Mount Type:Clearance Hole
Orientation:Right Angle
Tail Length:.1 in, 2.54 mm
Contact Type:Loop Bellow
Number of Rows:2
Connector Width:.37 in, 9.4 mm
Contact Plating:Gold
Connector Height:15.49 mm, .61 in
Contact Material:Beryllium Copper
Termination Method:Solder
Number of Positions:50
Termination Plating:Matte Tin
Operating Temperature Range:-65 - 150 °C
Card Thickness:0.062 in
Current Rating:3 A
Voltage Rating:950 VAC
Number of Contacts:50
SKU:SULACM25DTAD

Detailed Description

Introducing the ACM25DTAD, a high-performance board-to-board PCB connector designed for demanding applications. Featuring a contact layout of two rows with 50 positions, this female connector ensures reliable connectivity in complex circuitry. Crafted from PPS and Beryllium Copper, it offers exceptional durability and conductivity. The termination method of Thru Hole with Matte Tin plating guarantees secure and long-lasting attachment to the PCB. With a contact material of Beryllium Copper plated with Gold, it provides superior signal transmission and resistance to corrosion. Operable in extreme temperatures ranging from -65 to 150 °C, this connector is ideal for use in harsh environments. Its loop bellow contact type and right-angle orientation allow for efficient and space-saving installations. With a voltage rating of 950 VAC and amperage of 3A, it ensures safe and efficient power transfer. The tail length of 2.54 mm and pitch of 3.96 mm facilitate easy mating and assembly. Measuring at a compact height of 15.49 mm and width of 9.4 mm, it is suitable for compact electronic devices. The ACM25DTAD is a top choice for applications requiring high reliability and performance in board-to-board connectivity.