ECA35DTMT

Heilind Number:SULECA35DTMT
Manufacturer:Sullins Connector Solutions
Manufacturer Number:ECA35DTMT
ECAD Model:
3D Model

Description:

PBT & PHOSPHOR BRONZE; .00

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions ECA35DTMT
Pitch:0.125 in
Gender:Female
Voltage:750 VAC
Amperage:3 A
Mount Type:Threaded
Orientation:Right Angle
Tail Length:.25 in, 6.35 mm
Contact Type:Loop Bellow
Number of Rows:2
Connector Width:.37 in, 9.4 mm
Contact Plating:Gold
Connector Height:15.49 mm, .61 in
Contact Material:Phosphor Bronze
Termination Method:Solder
Number of Positions:70
Termination Plating:Matte Tin
Operating Temperature Range:-65 - 125 °C
Card Thickness:0.062 in
Current Rating:3 A
Voltage Rating:750 VAC
Number of Contacts:70
SKU:SULECA35DTMT

Detailed Description

The ECA35DTMT is a high-performance board-to-board PCB connector designed for demanding applications. Featuring a durable construction of PBT and Phosphor Bronze, this connector ensures reliable connectivity in harsh environments. With a current rating of 3A and a voltage capacity of 750VAC, it is suitable for power and signal transmission. The female connector has two rows, each with 70 positions, providing ample connectivity options. Its threaded mount type and thru-hole termination method offer secure and stable installation. The contact material of Phosphor Bronze with Gold plating guarantees low contact resistance and high durability. With a pitch of 3.18mm, it is compatible with various PCB layouts. The right-angle orientation and loop bellow contact type make it space-efficient and easy to use. Operating flawlessly in temperatures ranging from -65 to 125°C, this connector is reliable in extreme conditions. Its compact size, with a height of 15.49mm and width of 9.4mm, makes it suitable for compact electronic devices. The matte tin termination plating ensures long-term reliability. Overall, the ECA35DTMT is a top-of-the-line connector that meets the stringent requirements of hi-rel applications.