ECC60DPSI

Heilind Number:SULECC60DPSI
Manufacturer:Sullins Connector Solutions
Manufacturer Number:ECC60DPSI
ECAD Model:
3D Model

Description:

PBT & PHOSPHOR BRONZE; .00

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions ECC60DPSI
Amperage:3 A
Gender:Female
Number of Contacts:120
Number of Rows:2
Mount Type:Threaded
Termination Method:Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Pitch:0.1 in
Voltage:700 VAC
Contact Type:Double Point
Orientation:Straight
Number of Positions:120
Tail Length:.19 in, 4.83 mm
Operating Temperature Range:-65 - 125 °C
Connector Height:15.49 mm, .61 in
Connector Width:10.16 mm, .4 in
Current Rating:3 A
Termination Plating:Matte Tin
Voltage Rating:700 VAC
Card Thickness:0.062 in
SKU:SULECC60DPSI

Detailed Description

Introducing the ECC60DPSI, a high-performance board-to-board PCB connector designed for superior connectivity in demanding environments. This female connector features two rows with a pitch of 2.54mm (.1 in), offering 120 positions for efficient data transmission. Crafted with PBT and Phosphor Bronze materials, it ensures durability and reliability in operation. The termination method is through-hole, with a threaded mount type for secure installation. Contacts plated in gold provide optimal conductivity, suitable for applications requiring a current rating of 3A and a voltage of 700VAC. With a double-point contact type and straight orientation, signal integrity is maintained with low insertion loss. Operating within a wide temperature range of -65°C to 125°C, this connector is ideal for various industrial and commercial uses. Its compact design, with a height of .61in (15.49mm) and width of .4in (10.16mm), makes it space-efficient on PCBs. The tail length of .19in (4.83mm) allows for easy soldering. Termination plating in matte tin ensures compliance with RoHS standards. The ECC60DPSI connector is a reliable solution for your interconnect needs, offering high-performance connectivity in a compact form factor.