GCC08DRYI-S13

Heilind Number:SULGCC08DRYI-S13
Manufacturer:Sullins Connector Solutions
Manufacturer Number:GCC08DRYI-S13
ECAD Model:
3D Model

Description:

PA9T & PHOSPHOR BRONZE .0

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions GCC08DRYI-S13
Amperage:3 A
Gender:Female
Number of Contacts:16
Number of Rows:2
Mount Type:Threaded
Termination Method:Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Pitch:0.1 in
Voltage:700 VAC
Contact Type:Full Bellow
Orientation:Straddle
Number of Positions:16
Tail Length:10.8 mm, .425 in
Operating Temperature Range:-65 - 125 °C
Connector Height:10.95 mm, .431 in
Connector Width:.33 in, 8.38 mm
Current Rating:3 A
Termination Plating:Matte Tin
Voltage Rating:700 VAC
Card Thickness:0.062 in
SKU:SULGCC08DRYI-S13

Detailed Description

Featuring a robust construction, the GCC08DRYI-S13 connector is designed for high-performance applications. With PA9T and Phosphor Bronze materials, it ensures durability and reliability in demanding environments. This female connector, with two rows and a threaded mount type, offers secure and stable connections. The termination method of Card Extender guarantees easy installation. Contact points made of Gold-plated Phosphor Bronze ensure excellent conductivity. With a pitch of 2.54mm, it accommodates precise PCB layouts. Rated for 700VAC and 3A, it meets stringent electrical requirements. The Full Bellow contact type and Straddle orientation further enhance its functionality. With 16 positions and a tail length of 10.8mm, it provides ample connectivity options. Operating in a wide temperature range from -65 to 125°C, it is suitable for diverse industrial settings. The connector's compact design, with dimensions of 10.95mm (H) x 8.38mm (W), allows for efficient PCB integration. Terminated with Matte Tin plating, it ensures corrosion resistance. Classified under Board To Board PCB Connectors and Card Edge Connectors, the GCC08DRYI-S13 is a vital component for high-reliability applications.