GCC13DCBD-S189

Heilind Number:SULGCC13DCBD-S189
Manufacturer:Sullins Connector Solutions
Manufacturer Number:GCC13DCBD-S189
ECAD Model:
3D Model

Description:

PA9T & PHOSPHOR BRONZE .0

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions GCC13DCBD-S189
Amperage:3 A
Gender:Female
Number of Contacts:26
Number of Rows:2
Mount Type:Clearance Hole
Termination Method:Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Pitch:0.1 in
Voltage:700 VAC
Contact Type:Hairpin
Orientation:Right Angle
Number of Positions:26
Tail Length:.18 in, 4.57 mm
Operating Temperature Range:-65 - 125 °C
Connector Height:15.49 mm, .61 in
Connector Width:.37 in, 9.4 mm
Current Rating:3 A
Termination Plating:Matte Tin
Voltage Rating:700 VAC
Card Thickness:0.062 in
SKU:SULGCC13DCBD-S189

Detailed Description

Introducing the GCC13DCBD-S189, a high-performance board-to-board PCB connector designed for demanding applications. This connector features two rows of female terminals with a pitch of 2.54mm, ensuring secure and reliable connections. With a voltage rating of 700VAC and an amperage of 3A, it is suitable for power and signal transmission. The contact material is made of phosphor bronze with gold plating, guaranteeing excellent conductivity and corrosion resistance. Its hairpin contact type and right-angle orientation provide efficient PCB mating. Operating within a wide temperature range of -65 to 125°C, this connector is built to withstand harsh environments. The termination method is through-hole, with matte tin plating, offering durable and stable solder connections. With 26 positions and a tail length of 4.57mm, it allows for versatile connectivity options. The connector's compact design, measuring only 15.49mm in height and 9.4mm in width, makes it ideal for space-constrained applications. Whether used in aerospace, defense, or industrial electronics, the GCC13DCBD-S189 ensures high reliability and performance, meeting the stringent requirements of hi-rel environments.