HBC17DKNI

Heilind Number:SULHBC17DKNI
Manufacturer:Sullins Connector Solutions
Manufacturer Number:HBC17DKNI
ECAD Model:
3D Model

Description:

PBT & BERYLLIUM COPPER .0

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions HBC17DKNI
Amperage:3 A
Gender:Female
Number of Contacts:34
Number of Rows:2
Mount Type:Threaded
Termination Method:Card Extender
Contact Material:Beryllium Copper
Contact Plating:Gold
Pitch:0.1 in
Voltage:700 VAC
Contact Type:Cantilever
Orientation:Straddle
Number of Positions:34
Tail Length:15.37 mm, .605 in
Operating Temperature Range:-65 - 125 °C
Connector Height:13.97 mm, .55 in
Connector Width:.37 in, 9.4 mm
Current Rating:3 A
Termination Plating:Matte Tin
Voltage Rating:700 VAC
Card Thickness:0.062 in
SKU:SULHBC17DKNI

Detailed Description

The HBC17DKNI is a high-performance board-to-board PCB connector designed for demanding applications. Featuring a durable construction of PBT and Beryllium Copper, it ensures reliable connectivity in harsh environments. With a current rating of 3A and a voltage resistance of 700VAC, this connector is perfect for power and signal transmission. Its female gender, 2-row configuration, and threaded mount type offer secure and stable connections. The contact material of Beryllium Copper with gold plating guarantees low contact resistance and high conductivity. With a pitch of 2.54mm, it is compatible with standard PCB layouts. The cantilever contact type and straddle orientation provide efficient mating. Offering 34 positions and a tail length of 15.37mm, it accommodates multiple connections. Operating in a wide temperature range of -65 to 125°C, it is suitable for diverse industrial applications. The termination method of Card Extender with matte tin plating ensures durability and longevity. With a compact design, measuring 13.97mm in height and 9.4mm in width, it saves space on the PCB. The HBC17DKNI is a versatile and reliable connector, ideal for use in aerospace, defense, telecommunications, and other hi-rel environments.