JCC65DRAS

Heilind Number:SULJCC65DRAS
Manufacturer:Sullins Connector Solutions
Manufacturer Number:JCC65DRAS
ECAD Model:
3D Model

Description:

PA9T & BERYLLIUM COPPER .

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Specifications

AttributeValue
Product Category:
Manufacturer:Sullins Connector Solutions
Manufacturer Part Number:Sullins Connector Solutions JCC65DRAS
Amperage:3 A
Gender:Female
Number of Contacts:130
Number of Rows:2
Mount Type:Side Hole
Termination Method:Solder
Contact Material:Beryllium Copper
Contact Plating:Gold
Pitch:0.1 in
Voltage:700 VAC
Contact Type:Full Bellow
Orientation:Right Angle
Number of Positions:130
Tail Length:.125 in, 3.18 mm
Operating Temperature Range:-65 - 150 °C
Connector Height:10.95 mm, .431 in
Connector Width:10.16 mm, .4 in
Current Rating:3 A
Termination Plating:Matte Tin
Voltage Rating:700 VAC
Card Thickness:0.062 in
SKU:SULJCC65DRAS

Detailed Description

The JCC65DRAS is a high-performance board-to-board PCB connector designed for demanding applications. Featuring PA9T and Beryllium Copper construction, it ensures durability and reliable performance. With a 3A amperage rating and 700VAC voltage capability, it meets stringent power requirements. The connector, with a gender of female and two rows, offers versatile connectivity options. Its side hole mount type and thru-hole termination method ensure secure and stable attachment. The contact material of Beryllium Copper with gold plating guarantees excellent conductivity and corrosion resistance. With a pitch of 2.54mm (.1 in) and 130 positions, it facilitates high-density connections. The right-angle orientation and full bellow contact type further enhance its suitability for various electronic devices. Operating within a wide temperature range of -65 to 150°C, it is reliable in harsh environments. The connector's compact design, with a height of 10.95mm (.431 in) and width of 10.16mm (.4 in), allows for space-efficient PCB layouts. The termination plating of Matte Tin ensures compatibility with lead-free soldering processes. Overall, the JCC65DRAS is a top-of-the-line solution for board-to-board connectivity in industrial, aerospace, and telecommunications applications.