1-102387-4

Heilind Number:AMP1-102387-4
Manufacturer:TE Connectivity
Manufacturer Number:1-102387-4
ECAD Model:
3D Model

Description:

08 MODIV HSG COMP DR .100 POL

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-102387-4
Amperage:3 A
Connector Type:Housing
Housing Material:Thermoplastic
Number of Rows:2
Termination Method:Crimp
Contact Material:Beryllium Copper
Overall Height:.285 in, 7.23 mm
Overall Length:12.7 mm, .5 in
Pitch:.1 in, 2.54 mm
Contact Type:Socket
Strain Relief:No Strain Relief
Row Spacing:.1 in, 2.54 mm
Number of Positions:8
Housing Color:Black
Operating Temperature Range:-65 - 105 °C, -85 - 221 °F
Circuit Application:Signal
Connector System:Wire to Board
Mating Retention:Without
Connector and Housing Type:Receptacle
Operating Voltage:250 VAC
SKU:AMP1-102387-4

Detailed Description

This Pin & Socket Housing is designed for optimal signal connectivity in electronic applications. With a current rating of 3 A and a durable thermoplastic housing, it ensures reliable performance in various environments. Featuring two rows of contacts and a crimp termination method, it offers easy and secure wire connectivity. The beryllium copper contacts and black housing color provide both conductivity and visual appeal. With an overall height of .285 inches and a pitch of 2.54 mm, it is suitable for compact PCB layouts. Operating within a wide temperature range of -65 to 105 °C, it is ideal for demanding industrial settings. RoHS compliant and rated for 250 VAC, this housing is a dependable choice for wire-to-board connections.