1-2199119-3

Heilind Number:AMP1-2199119-3
Manufacturer:TE Connectivity
Manufacturer Number:1-2199119-3
Datasheet:Drawing
ECAD Model:
3D Model

Description:

M.2 0.5PITCH 3.2H KEY M GOLDFLASH

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1-2199119-3
Series:M.2 NGFF
Housing Material:High Temperature Thermoplastic
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:.0197 in, 5 mm
Voltage:50 V AC
Keying:M
Contact Amperage:.5 A
Number of Positions:67
Housing Color:Black
Mount Orientation:Right Angle
GPL:A53
Packaging:Tape & Reel
Operating Temperature Range:-40 - 176 °F, -40 - 80 °C
Circuit Application:Power
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:3 µin
PCB Contact Termination Area Plating:Gold Flash, Tin
Connector Height:.126 in, 3.2 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:J649
Connector Length:21.9 mm, .862 in
Connector System:Board to Board
ECCN:EAR99
PCB Contact Termination Area Plating Finish:Matte
Connector Width:.343 in, 8.7 mm
Part Aliases:1-2199119-3
SKU:AMP1-2199119-3

Detailed Description

Introducing the M.2 NGFF Board-to-Board Connector, designed for high-performance applications. With a compact .5mm pitch and 3.2mm stack height, this connector features a robust copper alloy contact material with gold flash plating for reliable power transmission at up to 50V AC and .5A. Its right-angle mount orientation and surface mount termination method offer easy installation onto printed circuit boards. The black high-temperature thermoplastic housing ensures durability in harsh operating conditions, with an extended temperature range of -40 to 80°C. Measuring .862 inches in length and .343 inches in width, it offers a total of 67 positions for seamless connectivity. This connector is ideal for use in various electronic devices, providing efficient board-to-board connections with enhanced signal integrity.