| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 102548-1 |
| Series: | AMPMODU IV/V |
| Amperage: | 3 A |
| Gender: | Female |
| Termination Method: | Crimp |
| Contact Material: | Beryllium Copper |
| Voltage: | 250 VAC |
| Contact Type: | Socket |
| Package Quantity: | 12500 |
| Insulation Resistance: | 5000 MΩ |
| GPL: | 277 |
| Packaging: | Strip |
| Operating Temperature Range: | -65 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 15 µin |
| GPL Description: | Industrial |
| Lead Free Solder Processes: | Not applicable for solder process capability |
| Connector and Contact Terminate To: | Wire & Cable |
| Product Code: | 5207 |
| Wire Size: | .12 - .4 mm², 26 - 22 AWG |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 750 V |
| Termination Resistance: | 12 mΩ |
| Applied_Pressure: | Intermediate |
| Wire Insulation Support: | With |
| Accepts Wire Insulation Diameter: | .061 in, 1.55 mm |
| Compatible Wire / Cable Type: | Discrete Wire |
| Wire Contact Termination Area Plating Material: | Gold Flash |
| Standards Met: | UL E28476;CSA LR7189 |
| Part Aliases: | 102548-1 |
| SKU: | AMP102548-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/29/2015 | P-15-011207 - Product improvement. UPDATING ESTIMATED FIRST SHIP DATE FOR CHANGED PARTS DUE TO DELAY IN PROCESSING ENGINEERING CHANGE. | Download |
| 03/01/2015 | E-14-017571 - PRODUCT IMPROVEMENT. CU-NI-SI MATERIAL PASSES 108-25020 REQUIREMENTS. STANDARDIZATION OF THE BASE MATERIAL OF MOD IV RECEPTACLE CONTACTS. MATERIAL CHANGE FROM BERYLLIUM COPPER TO COPPER-NICKEL-SILICON. | Download |