1571424-1

Heilind Number:AMP1571424-1
Manufacturer:TE Connectivity
Manufacturer Number:1571424-1
ECAD Model:
3D Model

Description:

40 50/50 HDR DRST TH .250

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1571424-1
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Pin
Row Spacing:.05 in, 1.27 mm
Number of Positions:40
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Header Type:Shrouded
Stack Height:.25 in, 6.35 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP1571424-1

Detailed Description

This vertical mount board-to-board header boasts a high-performance design, featuring two rows of 40 gold-plated pins with a contact pitch of 1.27mm (.05 in). With a rugged housing made of Liquid Crystal Polymer and through-hole solder termination, it ensures secure and reliable connectivity in demanding applications. The shrouded header with a stack height of 6.35mm (.25 in) offers enhanced protection and alignment during mating. Crafted with copper alloy contacts, it guarantees efficient signal transmission. Ideal for mezzanine and board stacking connections, this connector is a versatile solution for your PCB assembly needs. Rest assured, it complies with RoHS regulations, making it environmentally friendly. Elevate your electronic designs with this premium-quality board-to-board header.