| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 1761987-9 |
| Series: | QSFP/QSFP+ |
| Mount Type: | Board Mount |
| Termination Method: | Surface Mount |
| Contact Plating: | Gold |
| Pitch: | .032 in, .8 mm |
| Data Interface: | QSFP+ |
| Contact Amperage: | .5 A |
| Number of Positions: | 38 |
| Data Rate: | 14 Gb/s |
| GPL: | K71 |
| Packaging: | Reel, Tape |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .057 in, 1.45 mm |
| Sealable: | No |
| GPL Description: | Data and Devices |
| Lead Free Solder Processes: | Reflow solder capable to 260°C |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | L760 |
| Connector System: | Board to Board |
| Connector Product Type: | Connector |
| ECCN: | EAR99 |
| Standards Met: | UL 94V-0 |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1761987-9 |
| SKU: | AMP1761987-9 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |