1963850-2

Heilind Number:AMP1963850-2
Manufacturer:TE Connectivity
Manufacturer Number:1963850-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

XFP. MSA HEATSINK 10mm TALL

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1963850-2
Series:XFP
Accessory Type:Clip
Body Material:Aluminum, Cold-Forged Aluminum
Device Type:XFP
GPL:J33
GPL Description:Data and Devices
Product Code:L030
Body Plating Material:Electroless Nickel
ECCN:EAR99
Height:10 mm, .394 in
Width:18 mm
Number of Fins:72
Fin Style:Pin Fin
Power:10 W, 15 W, 5 W
Part Aliases:1963850-2
SKU:AMP1963850-2

Detailed Description

Enhance the cooling performance of your XFP devices with this MSA HEATSINK. Designed with precision, this 10mm tall heatsink features an aluminum body with cold-forged construction for optimal heat dissipation. Its Electroless Nickel plating ensures durability, while the 72 Pin Fin design maximizes surface area for efficient cooling. With a power rating of 15W, 10W, and 5W, it provides reliable thermal management for your XFP modules. RoHS compliant, it meets environmental standards without compromising on performance. Upgrade your setup with this essential accessory for Data and Devices applications.