| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1963850-2 |
| Series: | XFP |
| Accessory Type: | Clip |
| Body Material: | Aluminum, Cold-Forged Aluminum |
| Device Type: | XFP |
| GPL: | J33 |
| GPL Description: | Data and Devices |
| Product Code: | L030 |
| Body Plating Material: | Electroless Nickel |
| ECCN: | EAR99 |
| Height: | 10 mm, .394 in |
| Width: | 18 mm |
| Number of Fins: | 72 |
| Fin Style: | Pin Fin |
| Power: | 10 W, 15 W, 5 W |
| Part Aliases: | 1963850-2 |
| SKU: | AMP1963850-2 |
1963850-2
Specifications
Detailed Description
Enhance the cooling performance of your XFP devices with this MSA HEATSINK. Designed with precision, this 10mm tall heatsink features an aluminum body with cold-forged construction for optimal heat dissipation. Its Electroless Nickel plating ensures durability, while the 72 Pin Fin design maximizes surface area for efficient cooling. With a power rating of 15W, 10W, and 5W, it provides reliable thermal management for your XFP modules. RoHS compliant, it meets environmental standards without compromising on performance. Upgrade your setup with this essential accessory for Data and Devices applications.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
| TE Connectivity 1489951-1 | ![]() | |
| TE Connectivity 1658871-1 | ![]() | |
| TE Connectivity 1658945-1 | ![]() | |
| TE Connectivity 1888101-1 | ![]() | |
| TE Connectivity 2170435-1 | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/30/2026 | PCN-25-249613 - Manufacturing location change. TE's on-going supply chain risk management strategy, the listed products are to be migrated to production sites from Zhuhai China plant to Dongguan China plant. | Download | |||


