1963854-2

Heilind Number:AMP1963854-2
Manufacturer:TE Connectivity
Manufacturer Number:1963854-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

HEAT SINK SFP DWDM 10.0mm TALL

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 1963854-2
Accessory Type:Clip
Body Material:Aluminum, Cold-Forged Aluminum
Device Type:SFP
GPL:J33
GPL Description:Data and Devices
Product Code:L030
Body Plating Material:Electroless Nickel
ECCN:EAR99
Number of Fins:50
Fin Style:Pin Fin
Power:10 W, 15 W, 5 W
Part Aliases:1963854-2
SKU:AMP1963854-2

Detailed Description

Enhance the thermal management of your SFP DWDM module with this high-performance Heat Sink. Designed for optimal heat dissipation, it features a compact yet efficient Pin Fin design with 50 fins, making it perfect for applications requiring reliable cooling. Crafted from durable Aluminum with Electroless Nickel plating, this Heat Sink ensures long-lasting performance even in demanding environments. With a height of 10.0mm, it provides efficient heat transfer while maintaining a low profile. Suitable for use with 5W, 10W, and 15W power devices, it is a versatile solution for maintaining optimal operating temperatures. RoHS compliant, it meets strict environmental standards, making it a sustainable choice for your thermal management needs. Upgrade your setup with this essential accessory for Data and Devices.