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Stock Location: In Stock
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Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 5-103673-1
Series: AMPMODU MTE
Amperage: 3 A
Housing Material: Thermoplastic
Number of Contacts: 2
Number of Rows: 1
Termination Method: Crimp, Insulation Displacement Crimp (IDC), Through Hole - Solder
Contact Material: Brass
Pitch: .1 in, 2.54 mm
Contact Type: Pin
Strain Relief: No Strain Relief
Row Spacing: .1 in, 2.54 mm
Package Quantity: 70
Contact Amperage: 3 A
Number of Positions: 2
Housing Color: Black
Mount Orientation: Right Angle
Insulation Resistance: 5000 MΩ
GPL: 296
Packaging: Tube, Tube/Box
Operating Temperature Range: -65 - 105 °C
Circuit Application: Signal
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: 15 µin
PCB Retention: With
PCB Contact Termination Area Plating: Tin
PCB Thickness (Recommended): .062 in, 1.57 mm
Connector Height: 13.59 mm, .535 in
PCB Retention Type: Hold-Down
GPL Description: Industrial
Lead Free Solder Processes: Reflow solder capable to 260°C
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 6258
Connector Length: .3 in, 7.62 mm
ECCN: EAR99
Dielectric Withstanding Voltage: 600 V
Termination Resistance: 15 mΩ
Contact Shape: Square
PCB Contact Termination Area Plating Finish: Matte
Mating Retention: With
PCB Mount Alignment: Without
Termination Post Tail Length: .13 in, 3.3 mm
Header Type: Shrouded
Connector Assembly Type: PCB Mount Header
PCB Contact Termination Area Plating Thickness: 100 µin, 2.54 µm
Contact Mating Area Length: .23 in, 5.84 mm
Contact Retention: With
Contact Retention Type in Housing: Locking Lance
Temperature Rating: High
Standards Met: CSA LR7189;UL E28476
Material Flammability Standard: UL 94V-0
Part Aliases: 5-103673-1
SKU: AMP5-103673-1

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
05/29/2020 E-20-000624 - Product Improvement. To provide flexibility to our manufacturing processes, we are allowing the manufacturing plants, when possible, to utilize regrind resin, up to the allowable limit specified on the UL Yellow Card, in the molding process. Adding feature at latch to increase mold efficiency.
Download
03/31/2017 E-16-014613 - Product Improvement. TE Connectivity has retooled the MTE header product line to use high temperature compatible LCP molding material. These changes will result in the following product changes: 1) Housing material will change from high temperature nylon to LCP. 2) The header housing width will be reduced by 0.005 inches to accommodate the assembly process. 3) In order to consolidate some housing features, the contact cavity configuration will be changed slightly as shown in the attached sketch. Download