5-146276-8

Heilind Number:AMP5-146276-8
Manufacturer:TE Connectivity
Manufacturer Number:5-146276-8
ECAD Model:
3D Model

Description:

08 MODII HDR SRST B/A .100CL

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-146276-8
Amperage:3 A
Housing Material:Liquid Crystal Polymer
Number of Rows:1
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.1 in, 2.54 mm
Contact Type:Pin
Number of Positions:8
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Header Type:Breakaway
Product:Board-to-Board Headers & Receptacles
SKU:AMP5-146276-8

Detailed Description

Enhance your PCB connectivity with this high-performance board-to-board header. With a sleek vertical mount orientation and through-hole solder termination method, it ensures secure and reliable connections. The contact pins, made of durable copper alloy with gold plating, guarantee excellent conductivity. Its liquid crystal polymer housing material offers exceptional durability, making it ideal for various electronic applications. With a pitch of 2.54mm (.1 in) and 8 positions, this header is perfect for mezzanine and board stacking configurations. Rest assured, it complies with RoHS standards, meeting environmental regulations. Upgrade your PCB assembly with this top-quality connector.