5-146483-3

Heilind Number:AMP5-146483-3
Manufacturer:TE Connectivity
Manufacturer Number:5-146483-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

06 MODII HDR DRST UNSHRD STKG

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-146483-3
Amperage:3 A
Housing Material:Thermoplastic
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.1 in, 2.54 mm
Contact Type:Pin
Row Spacing:.1 in, 2.54 mm
Number of Positions:6
Mount Orientation:Vertical
Contact Mating Area Plating:Tin
Header Type:Breakaway
Stack Height:.2 in, 5.08 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP5-146483-3

Detailed Description

Enhance your PCB connectivity with this 2-row, 6-position board-to-board header. Featuring a vertical mount orientation and through-hole solder termination, it ensures secure and reliable connections. The thermoplastic housing and copper alloy contacts guarantee durability, while the tin plating in the mating area ensures optimal conductivity. With a pitch of 2.54mm (.1 in) and a stack height of 5.08mm (.2 in), this header is perfect for mezzanine and board stacking applications. RoHS compliant and of high quality, it is a must-have component for your electronic projects.