MOD IV RECP PLTD 30 SEL
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 85969-8 |
| Series: | AMPMODU IV/V |
| Gender: | Female |
| Termination Method: | Crimp |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Voltage: | 250 VAC |
| Contact Type: | Socket |
| Package Quantity: | 12500 |
| Insulation Resistance: | 5000 MΩ |
| GPL: | 277 |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin |
| GPL Description: | Industrial |
| Lead Free Solder Processes: | Not applicable for solder process capability |
| Connector and Contact Terminate To: | Wire & Cable |
| Wire Size: | 20 - 24 AWG, .2 - .6 mm² |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 750 V |
| Termination Resistance: | 12 mΩ |
| Applied_Pressure: | Standard |
| Wire Insulation Support: | With |
| Compatible Wire / Cable Type: | Discrete Wire |
| Wire Contact Termination Area Plating Material: | Gold Flash |
| Wire Contact Termination Area Plating Thickness: | 30 µin |
| Standards Met: | CSA LR7189;UL E28476 |
| Part Aliases: | 85969-8 |
| SKU: | AMP85969-8.P |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/29/2015 | P-15-011207 - Product improvement. UPDATING ESTIMATED FIRST SHIP DATE FOR CHANGED PARTS DUE TO DELAY IN PROCESSING ENGINEERING CHANGE. | Download |
| 03/01/2015 | E-14-017571 - PRODUCT IMPROVEMENT. CU-NI-SI MATERIAL PASSES 108-25020 REQUIREMENTS. STANDARDIZATION OF THE BASE MATERIAL OF MOD IV RECEPTACLE CONTACTS. MATERIAL CHANGE FROM BERYLLIUM COPPER TO COPPER-NICKEL-SILICON. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |