| 01/14/2026 | P-26-029601 - Product Improvement. Further to our Product Change Notifications (PCNs) P-25-028774 and P-25-028773, issued on September 10th, 2025, we are pleased to inform you that the reformulation and requalification of our /225 pre coated adhesive, used on TE Connectivity heat shrink molded parts, has been successfully completed. /225 remains fully compliant with TE specification RW-2074 and external QPL requirements. | Download |
| 10/31/2025 | P-25-028773 - Product Improvement. this notice informs you of a change to the compound formulation of the /225 precoat adhesive used on TE Connectivity s heat-shrink molded parts. The /225 precoat is manufactured from raw materials sourced from external vendors and a vendor has obsoleted one of the raw materials used in the compound. The replacement of this raw material requires a reformulation, which will follow TE s defined change procedure to maintain safety, quality, and compliance. There will be increased lead times on impacted products for a short time. TE is committed to resolving this as soon as possible.
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| 10/06/2025 | P-25-028957 - Manufacturing Location Change. This a raw material location change only. There is no change to the raw material formulation or material chemistry, and no change in production process. Therefore, there is no change to fit, form and function, and TE does not need to reformulate our finished product.
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