| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2007884-1 |
| Series: | IMPACT |
| Amperage: | .75 A |
| Connector Type: | Header |
| Gender: | Plug |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Rows: | 18 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Copper Alloy |
| Pitch: | .075 in, 1.9 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| Contact Length: | .177 in, 18.9 mm, 4.5 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| PCB Hole Diameter: | .015 in, .39 mm |
| Number of Pairs: | 60 |
| Number of Positions: | 180 |
| Data Rate: | 20 - 25 Gb/s |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| GPL: | K74 |
| Tail Length: | .055 in, 1.4 mm |
| Packaging: | Box & Tube, Package |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.92 µin, .76 µm |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Thickness (Recommended): | 1 mm |
| Connector Height: | 11.95 mm, .47 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | L352 |
| Number of Columns: | 10 |
| Number of Signal Positions: | 120 |
| Contact Design: | Dual Beam |
| Contact Layout: | Inline |
| Contact Transmits: | Signal (Data) |
| Connector Length: | .744 in |
| Connector System: | Board to Board |
| UL Agency Certification: | E28476 |
| Contact Termination Plating: | Tin |
| Stackable: | No |
| Connector Product Type: | Connector |
| Pairs Per Column: | 6 |
| Contact Style: | Press-Fit |
| Board to Board Configuration: | Right Angle, Vertical |
| Contact Underplating Thickness: | 1.27 µm, 50 µin |
| PCB Contact Termination Area Plating Finish: | Matte |
| Connector Width: | 1.138 in, 28.9 mm |
| Mating Retention: | Without |
| Make First / Break Last: | No |
| Shroud Type: | Partial |
| PCB Contact Termination Area Plating Thickness: | 30 - 60 µin, .76 - 1.52 µm |
| Guide Location: | Unguided |
| Number of Ground Positions: | 60 |
| End Wall Location: | Open |
| Guide Hardware: | Without |
| Signal Arrangement: | Differential |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 2007884-1 |
| SKU: | AMP2007884-1 |
2007884-1
| Heilind Number: | AMP2007884-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2007884-1 |
| Datasheet: | Material Declaration |
| ECAD Model: |
Specifications
Detailed Description
The IMP100S Board to Board Connector is a high-performance component designed for signal transmission in electronic systems. With a contact layout that features dual beam technology, it ensures reliable connectivity for data transfers. This connector is ideal for applications requiring a data rate of 20-25 Gb/s, with an impedance rating of 100 Ω. Its rugged construction, featuring LCP - GF housing material and gold-plated contact mating areas, guarantees durability in demanding environments. Equipped with press-fit termination for secure attachment to the PCB, it offers efficient signal transmission even in high-vibration settings. Operating within a wide temperature range of -55 to 85 °C, this connector is suitable for use in various industrial and commercial applications. Compliant with RoHS standards, it meets environmental regulations for sustainable manufacturing practices. Whether for telecommunications, aerospace, or automotive systems, the IMP100S Connector delivers superior performance and reliability in data transmission.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
| TE Connectivity 2007736-1 | ![]() | |
| TE Connectivity 2007739-1 | ![]() | |
| TE Connectivity 2007740-1 | ![]() | |
| TE Connectivity 2007741-1 | ![]() |


