2007884-1

Heilind Number:AMP2007884-1
Manufacturer:TE Connectivity
Manufacturer Number:2007884-1
Datasheet:Material Declaration
ECAD Model:
3D Model

Description:

IMP100S,H,V6P10C,UG,OEW39,4.5

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2007884-1
Series:IMPACT
Amperage:.75 A
Connector Type:Header
Gender:Plug
Housing Material:LCP - GF (Liquid Crystal Polymer)
Number of Rows:18
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Pin
Contact Length:.177 in, 18.9 mm, 4.5 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
PCB Hole Diameter:.015 in, .39 mm
Number of Pairs:60
Number of Positions:180
Data Rate:20 - 25 Gb/s
Housing Color:Black
Mount Orientation:Vertical
GPL:K74
Tail Length:.055 in, 1.4 mm
Packaging:Box & Tube, Package
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):1 mm
Connector Height:11.95 mm, .47 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L352
Number of Columns:10
Number of Signal Positions:120
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:.744 in
Connector System:Board to Board
UL Agency Certification:E28476
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:6
Contact Style:Press-Fit
Board to Board Configuration:Right Angle, Vertical
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:1.138 in, 28.9 mm
Mating Retention:Without
Make First / Break Last:No
Shroud Type:Partial
PCB Contact Termination Area Plating Thickness:30 - 60 µin, .76 - 1.52 µm
Guide Location:Unguided
Number of Ground Positions:60
End Wall Location:Open
Guide Hardware:Without
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2007884-1
SKU:AMP2007884-1

Detailed Description

The IMP100S Board to Board Connector is a high-performance component designed for signal transmission in electronic systems. With a contact layout that features dual beam technology, it ensures reliable connectivity for data transfers. This connector is ideal for applications requiring a data rate of 20-25 Gb/s, with an impedance rating of 100 Ω. Its rugged construction, featuring LCP - GF housing material and gold-plated contact mating areas, guarantees durability in demanding environments. Equipped with press-fit termination for secure attachment to the PCB, it offers efficient signal transmission even in high-vibration settings. Operating within a wide temperature range of -55 to 85 °C, this connector is suitable for use in various industrial and commercial applications. Compliant with RoHS standards, it meets environmental regulations for sustainable manufacturing practices. Whether for telecommunications, aerospace, or automotive systems, the IMP100S Connector delivers superior performance and reliability in data transmission.