| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5569381-1 |
| Color: | Black |
| Series: | SKT |
| Amperage: | 1.5 A, .2 A |
| Housing Material: | PCT Polyester |
| Mount Type: | Board Mount, Panel |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .04 in, 1.02 mm |
| USOC Codes: | RJ45 |
| LAN Category: | Cat 5 |
| Compatible RJ Type: | RJ45 |
| Keying: | No |
| Package Quantity: | 45 |
| Number of Positions: | 8 |
| Housing Color: | Black |
| Mount Orientation: | Right Angle |
| Grounding Tab Plating Material: | Tin over Copper |
| Latch Orientation: | Standard - Latch Down |
| GPL: | A92 |
| Profile: | Low |
| Shield Material: | Copper Alloy |
| Shield Plating Material: | Tin over Copper |
| Connector Contact Density: | Standard |
| Multiple Port Configuration: | Stacked |
| Number of Loaded Positions: | 8 |
| Mating Entry Location: | Side |
| Number of PCB Ground Tabs: | 6 |
| Port Configuration: | Multiple Ports |
| Port Matrix Configuration: | 2 x 1 |
| Status Indicator: | None |
| Tail Length: | .14 in, 3.56 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 185 °F, -40 - 85 °C |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm, 50 µin |
| Panel Mount: | Without |
| Shielded: | Yes |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .062 in, 1.57 mm |
| Connector Height: | 25.27 mm, .994 in |
| Grounding Options: | PCB and Panel Ground |
| Connector Type: | Jack |
| GPL Description: | Data and Devices |
| Lead Free Solder Processes: | Wave solder capable to 265°C |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Connectors and Connector Components Type: | Connector |
| Product Code: | 2287 |
| Modular Product Type: | RJ Type Jacks & Plugs |
| Standards Met: | UL 94V-0 |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1438092 |
| SKU: | AMP5569381-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/26/2023 | PCN-23-169522 - Process improvement. Change Tin plating from Pre-plating Tin to Dipped Tin on solder pin. | Download |
| 09/11/2020 | E-20-003649 - Product Improvement. Change product date code from label print type to laser marking type. No other changes for products. | Download |