22-29-2021

KK 254 Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits, Gold (Au) Plating

Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 22-29-2021
Color: Natural (White)
Series: 6410 - KK 254
Amperage: 4 A
Connector Type: KK 254
Number of Contacts: 2
Number of Rows: 1
Termination Method: Through Hole
Contact Material: Brass
Body Orientation: Straight
Pitch: 2.54 mm
Voltage: 500 V
Material: Nylon
Orientation: Vertical
Keying: No
Tail Length: 3.56 mm
Packaging: Bag
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: .508 µm
Number of Contacts Loaded: 2
PCB Locator: No
PCB Retention: Without
Polarized to PCB: No
Contact Termination Plating Thickness: .508 µm
Polarized to Mate: Yes
PCB Thickness (Recommended): 1.6 mm
Connector System: Wire to Board
CSA Agency Certification: LR19980
UL Agency Certification: E29179
Contact Termination Plating: Tin
Maximum Solder Process Temperature: 232 °C
Lead Free Process Capability: WAVE
Duration at Max. Process Temperature (seconds): 005
Max. Cycles at Max. Process Temperature: 001
Termination Pitch: 2.54 mm
Glow Wire Capable: No
Guide to Mating Part: No
Lock to Mating Part: Yes
Stackable: No
Surface Mount Compatible: No
Breakaway: No
Make First / Break Last: No
Shroud Type: Partial
Material Flammability Standard: 94V-0
Part Aliases: 0022292021;AE-6410-02A(241)
SKU: MOL22-29-2021

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
12/31/2022 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as
per attached list. No changes will be made to product as part of this change
Download
02/28/2022 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty
this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts.
Download
03/01/2021 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) Download
11/30/2020 509221 - Retraction of PCN 506276. retraction of DU min & MLQ Min qty update for kk part numbers Download
09/01/2019 507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. Download
04/25/2019 506276 - Packaging Method/Quantity Changing. The part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.
Download
07/01/2017 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. Download
02/01/2012 GCM 10523658 - Changing selected Mini-Fit and KK Product that were Overall Gold Plated Terminals to Select Gold, or Gold only in the contact area, and Matte Tin in solder tail area (changing solder tails from Overall Gold Plating to Matte Tin Plating). Download
02/01/2012 GCM 10534789 - Plating changed from all over Gold Plating to Selective Gold Plating.
Download