TE Connectivity (TE) ELCON Micro Power Connectors
TE Connectivity’s (TE) ELCON Micro wire-to-board power connectors provide a high current at 12.5A per pin in the common industry footprint of 3.0mm. This high current density in a compact design is useful for servers, switches, storage devices and testing machines. A common industry footprint also allows for easy upgrades to existing designs.
- High current density at 12.5A per pin maximum in the common industry footprint of 3.0mm (contact pitch)
- Common industry footprint allows for easy upgrades to existing designs
- Support 2 to 24 pin configurations and different currents with multiple combinations of different wire sizes
- ELCON Micro headers are PCB footprint compatible with other suppliers
- Easy assembly with virtually fool-proof mating features
- Perform reliably in harsh environments with maximum operating temperature of 105oC
- Computer / Datacom / Telecommunications
Servers, switches, storage devices, battery testing machines, business retail equipment (BRE)
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| ELCON MICRO,HEADER,VERTICAL DIP,4P | |||
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| Minimum: NA | Multiple: NA | ||
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| ELCON MICRO,HEADER,VERTICAL DIP,8P | |||
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| Immediate Shipment: | |||
| Minimum: NA | Multiple: NA | ||
| Stock Location: | Unit Of Measure: | ||
| Factory Lead: | Factory Stock: | ||
| ELCON MICRO,HEADER,VERTICAL DIP,16P | |||