1-826652-0

10P AMPMODU II STIFT LEI

Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 1-826652-0
Series: AMPMODU Headers
Housing Material: Polybutylene Terephthalate - GV
Number of Rows: 1
Termination Method: Through Hole - Solder
Contact Material: Phosphor Bronze
Pitch: .1 in, 2.54 mm
Contact Type: Pin
Strain Relief: No Strain Relief
Row Spacing: .1 in, 2.54 mm
Package Quantity: 300
Contact Amperage: 5 A
Number of Positions: 10
Housing Color: Green
Mount Orientation: Right Angle
GPL: 015
Profile: Standard
Packaging: Box
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: .8 µm
Panel Mount: Without
PCB Retention: Without
PCB Contact Termination Area Plating: Tin
Mating Alignment: Without
GPL Description: Industrial
Lead Free Solder Processes: Wave solder capable to 265°C
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 5231
Post Size: .024 in, .63 mm
Mating Post Length: .228 in, 5.8 mm
ECCN: EAR99
Dielectric Withstanding Voltage: 1000 V
Connector Contact Load Condition: Fully Loaded
Contact Shape: Square
Termination Post Tail Length: .126 in, 3.2 mm
Header Type: Breakaway
Connector Assembly Type: PCB Mount Header
PCB Contact Termination Area Plating Thickness: 3 µm
High Temperature Housing: No
Temperature Rating: Standard
Material Flammability Standard: UL 94V-0
Part Aliases: 1-826652-0
SKU: AMP1-826652-0

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
07/10/2014 E-14-002835 - Product Improvement. Streamlining of contact base material. Plating process transfer to TE Bydgoszcz. To maintain a competitive position in the market place.Product tested and validated see test report 502-19945. Download
10/29/2012 P-12-007877 - Manufacturing location change. Download