| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5413879-1 |
| Gender: | Jack |
| Mount Type: | Board Mount, Panel |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Mating Type: | Bayonet |
| Impedance: | 50 Ω |
| Operating Frequency: | 4 GHz |
| RF Connector Type: | BNC |
| Body Material: | Zinc |
| Number of Positions: | 1 |
| Mount Orientation: | Right Angle |
| Interface: | BNC |
| GPL: | 076 |
| Port Configuration: | Single Port |
| Tail Length: | .162 in, 4.11 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Panel Mount: | Rear Mount |
| PCB Retention: | With |
| PCB Retention Type: | Hold-Down Post |
| Panel Mount Type: | Lockwasher and Nut |
| Sealable: | No |
| GPL Description: | Data and Devices |
| Lead Free Solder Processes: | Wave solder capable to 265°C |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3133 |
| Number of Coaxial Contacts: | 1 |
| Mounting Post Length: | .137 in, 3.48 mm |
| Body Insulation: | Without |
| Body Plating Material: | Nickel |
| Center Contact Plating Material: | Gold |
| Center Contact Material: | Phosphor Bronze |
| Center Contact Plating Thickness: | 30 µin |
| Detent: | With |
| Dielectric Material: | Polymethylpentene |
| Height Above PC Board: | 12.7 mm, .5 in |
| Contact Captivation Method: | Mechanical |
| Mated Outer Diameter (Approximate): | 14.529 mm, .572 in |
| Product Grade: | Commercial |
| Connector System: | Cable to Board |
| Panel Attachment Style: | Rear Mount |
| Part Aliases: | 5413879-1 |
| SKU: | AMP5413879-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |