| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73644-1008 |
| Color: | Black, Natural |
| Series: | 73644 - HDM |
| Amperage: | 1 A |
| Connector Type: | HDM |
| Number of Contacts: | 144 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Phosphor Bronze, Stainless Steel |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 2 mm |
| Voltage: | 250 VAC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | Yes |
| Component Type: | PCB Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 144 |
| Mating Cycles: | 250 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .051 µm |
| PCB Thickness (Recommended): | 2.5 mm |
| Number of Columns: | 24 |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Gold |
| Termination Pitch: | 2 mm |
| Guide to Mating Part: | Yes |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0736441008 |
| SKU: | MOL73644-1008 |
73644-1008
Specifications
Detailed Description
Enhance your board-to-board connections with our HDM Backplane Header, designed for vertical assembly in high-density applications. Featuring a sturdy SMC construction with a press-fit termination method, this header ensures secure and reliable connectivity. With 144 circuits arranged in six rows, it accommodates complex signal paths with ease. The orientation is vertical, and a polarizing key at position E facilitates correct mating. Rated for 1A and 250VAC, it offers robust performance in a wide temperature range from -55 to 105°C. Gold-plated contacts on phosphor bronze and stainless steel ensure excellent conductivity and durability. Suitable for through-hole mounting, with a pitch of 2mm, it's ideal for PCB assembly. With UL and CSA certifications, you can trust in its quality and compliance. Whether you're designing telecommunications systems or industrial equipment, this backplane header is a versatile and reliable solution.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 73642-1000 | HDM Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 144 Circuits | ![]() |
| Molex 73644-1004 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position C, 144 Circuits | ![]() |
| Molex 73644-1005 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits | ![]() |
| Molex 73644-1009 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 144 Circuits | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 12/30/2023 | 514258 - Change Supplier. This notification is to inform you this is a change regarding the supplier. Please refer to the details below. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||


