| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73644-1013 |
| SKU: | MOL73644-1013 |
73644-1013
Specifications
Detailed Description
Enhance your board-to-board connections with our HDM Backplane Header, embodying cutting-edge design and functionality. Featuring a vertical orientation and SMC construction with a press-fit termination method, this header ensures secure and reliable connectivity in high-density applications. With 144 gold-plated contacts and a 2mm pitch, it offers optimal signal integrity and performance. The durable high-temperature thermoplastic housing, meeting stringent RoHS standards, guarantees long-term reliability in extreme operating conditions. Designed for 1 Gb/s data rates and 250 VAC voltage, this header is ideal for demanding environments. Its versatile features, including polarizing key positioning, make installation and maintenance hassle-free. Trust in the quality and efficiency of our HDM Backplane Header for seamless integration in your electronic systems.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 73642-1000 | HDM Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 144 Circuits | ![]() |
| Molex 73644-1004 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position C, 144 Circuits | ![]() |
| Molex 73644-1005 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits | ![]() |
| Molex 73644-1008 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits | ![]() |
| Molex 73644-1009 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 144 Circuits | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 12/30/2023 | 514258 - Change Supplier. This notification is to inform you this is a change regarding the supplier. Please refer to the details below. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||


