| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73644-1009 |
| Color: | Black, Natural |
| Series: | 73644 - HDM |
| Amperage: | 1 A |
| Connector Type: | HDM |
| Number of Contacts: | 144 |
| Number of Rows: | 6 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Phosphor Bronze, Stainless Steel |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 2 mm |
| Voltage: | 250 VAC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | Yes |
| Component Type: | PCB Header |
| Number of Pairs: | Open Pin Field |
| Data Rate: | 1 Gb/s |
| Tail Length: | 3.5 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -55 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 144 |
| Mating Cycles: | 250 |
| PCB Locator: | No |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | .051 µm |
| PCB Thickness (Recommended): | 2.5 mm |
| Number of Columns: | 24 |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Gold |
| Termination Pitch: | 2 mm |
| Guide to Mating Part: | Yes |
| Stackable: | Yes |
| Surface Mount Compatible: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0736441009 |
| SKU: | MOL73644-1009 |
73644-1009
| Heilind Number: | MOL73644-1009 |
| Manufacturer: | Molex |
| Manufacturer Number: | 73644-1009 |
| Datasheet: | RoHS Certificate of Compliance |
| ECAD Model: | |
Description:
HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 144 Circuits
More >>Specifications
Detailed Description
Enhance connectivity within your system with our HDM Board-to-Board Backplane Header. This vertical SMC connector features a press-fit design for secure installation, along with a guide post at Location A and a Polarizing Key at Position E for precise alignment. With 144 circuits, it offers ample connectivity options for your PCB setup. The durable construction, featuring phosphor bronze and stainless steel contacts with gold plating, ensures reliable performance even in demanding environments. Operating within a wide temperature range of -55 to 105 °C, and with a maximum voltage of 250 VAC and amperage of 1 A, this connector is suitable for various applications. Its through-hole termination method with compliant pins guarantees a stable connection, while the 2 mm pitch allows for efficient signal transmission. Whether you're designing for industrial, commercial, or aerospace purposes, this HDM connector is a versatile and high-quality solution.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 73642-1000 | HDM Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 144 Circuits |  |
 | Molex 73644-1004 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position C, 144 Circuits | |
 | Molex 73644-1005 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits | |
 | Molex 73644-1008 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 12/30/2023 | 514258 - Change Supplier. This notification is to inform you this is a change regarding the supplier. Please refer to the details below. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||
| 05/01/2021 | 509308 - Equipment Transfer, Production Transfer or Rearrangement. The purpose is to transfer the production line from current molex LRC factory US to Chengdu based factory. | Download | |||
Availability
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Unit Of Measure:
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Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 73644-1009 |
| Other Names: | 0736441009 |