767025-3

Heilind Number:AMP767025-3
Manufacturer:TE Connectivity
Manufacturer Number:767025-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MICT,707PLUG,114,ASSY,.025,REC

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 767025-3
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:.025 in, .64 mm
Voltage:30 V AC, 3 V DC
Contact Type:Pin
Row Spacing:.228 in, 5.79 mm
Impedance:50 Ω
Package Quantity:10
Contact Amperage:11.5 A
Number of Positions:114
Data Rate:10 Gb/s
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
GPL:481
Packaging:Box & Tube, Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:With
PCB Contact Termination Area Plating:Tin-Lead
PCB Thickness (Recommended):1.57 mm, .8 in
Connector Height:17.755 mm, .699 in
PCB Retention Type:Boardlock
Sealable:No
Ground Component Type:Ground Bus
Mating Alignment:Without
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:2434
Number of Columns:57
Number of Power Positions:3
Number of Signal Positions:114
Contact Layout:Inline
Connector Length:2 in, 50.8 mm
Connector System:Board to Board
CSA Agency Certification:1195944
UL Agency Certification:E28476
Stackable:Yes
ECCN:EAR99
Board to Board Configuration:Mezzanine
Contact Shape:Dual Beam
Connector Width:.32 in, 8.128 mm
Mating Retention:With
PCB Mount Alignment:With
PCB Mount Alignment Type:Boardlock, Locating Posts
Application Assembly Feature:None
Differential Signaling:Yes
Header Type:Header Only
Connector Assembly Type:PCB Mount Header
Stack Height:17.96 mm, 1.062 in, 27 mm
PCB Contact Termination Area Plating Thickness:150 - 250 µin
Standards Met:CSA
Material Flammability Standard:UL 94V-0
Part Aliases:767025-3
Replacement Part:5767025-3
SKU:AMP767025-3

Detailed Description

Enhance signal transmission with this high-performance Mezzanine & Board Stacking Connector. Featuring 114 contact positions in a dual-row layout, it ensures reliable connectivity for data and devices. With a pitch of .64 mm (.025 in) and impedance of 50 Ω, it supports high-speed data rates up to 10 Gb/s. The contact material is Copper Alloy with gold or palladium nickel plating for optimal conductivity. Designed for board-to-board applications, it offers vertical mounting with secure PCB retention through boardlock technology. Operating in a wide temperature range from -67 to 257 °F, it meets stringent standards for reliability. With UL 94V-0 and RoHS compliance, this connector guarantees safety and environmental responsibility. Perfect for various electronic assemblies, it's a versatile solution for demanding connectivity needs.